English

Thinksystem Sd530 Xeon Platinum 8276 Direct Water Cooled Server High-density Server 1

Thinksystem Sd530 Xeon Platinum 8276 Direct Water Cooled Server High-density Server 2

Thinksystem Sd530 Xeon Platinum 8276 Direct Water Cooled Server High-density Server

Name: Thinksystem Sd530 Xeon Platinum 8276 Direct Water Cooled Server High-density Server
Uploaded: 2025-02-19T19:30:05+08:00
Description: Thinksystem Sd530 Xeon Platinum 8276 Direct Water Cooled Server High-density Server

Samples:

$1000.0/piece | Min. order : 1 piece

Place of Origin:

China

Payments:

L/C,D/A,D/P,T/T,Western Union,MoneyGram,OA

Lead Time:

1-10(pieces):3(days),11-100(pieces):7(days),101-500(pieces):15(days),>500(pieces):To be negotiated(days)

shipping:

Support Sea freight

Customization:

Customized logo (Min. Order: 10000 sets),Customized packaging (Min. Order: 10000 sets),Graphic customization (Min. Order: 10000 sets)

Model Number:

SD530

Brand Name:

Lenovo

Inquiry

Write a Review

Memory

Up to 2TB in 16x slots, using 128GB 3DS RDIMMs

Form factor

2U rack enclosure

processor type

In tel Xeon Platinum 8276

processor main frequency

2.6Ghz

private mold

products status

Stock

Brand

Lenovo ThinkSystem

Power

2x hot-swap/redundant 1+1 1600W/2000W; or 2x non-redundant 1100W

Type

Rack

Place of Origin

Guangdong, China

Product Description

The Lenovo ThinkSystem SD530 is an ultradense and economical two-socket server in a 0.5U rack form factor. With four SD530 server nodes installed in the ThinkSystem D2 enclosure, and the ability to cable and manage up to four D2 enclosures as one asset, you have an ideal high-density 2U four-node (2U4N) platform for enterprise and cloud workloads. The SD530 now supports second-generation Intel Xeon Scalable processors, along with 2933 MHz TruDDR4 DIMMs and the new Intel Optane DC Persistent Memory.

Details Images

ThinkSystem SD530 Xeon Platinum 8276 Direct Water Cooled Server High-Density Server

Specification

Form factor	Half-wide, 1U compute node. Optional GPU Tray adds 1U.
Supported chassis	ThinkSystem D2 Enclosure, 2U high; up to 4 servers per chassis. ThinkSystem Modular Enclosure, 2U high; up to 4 servers per chassis.
Processor	One or two second-generation Intel Xeon Processor Scalable Family of processors (formerly codename "Cascade Lake"). Supports processors with up to 28 cores, core speeds up to 3.8 GHz, and TDP ratings up to 205W. Two Intel Ultra Path Interconnect (UPI) links at up to 10.4 GTps each.
Memory	* Configurations with some processors and heatsinks: Up to 16 DIMM sockets (8 DIMMs per processor) * Other processors: Up to 12 DIMM sockets (6 DIMMs per processor) DIMM slots are shared between standard system memory and persistent memory. Supports Lenovo TruDDR4 DIMMs at 2933 MHz or 2666 MHz. RDIMMs, LRDIMMs and 3DS RDIMMs are supported (RDIMMs currently only available), but memory types cannot be intermixed.
Storage bays	Up to six 2.5-inch hot-swap drive bays. Depending on the drive backplane selected, the supported drives can be SAS, SATA or NVMe drives. Up to four NVMe drives can be installed with a suitable drive backplane. Also supports one or two M.2 drives installed internally to each node. Other configurations exist including the substitution of a KVM Module in one drive bay for keyboard, video and mouse support. See the Internal storage section for details.
Storage controller	Onboard 6 Gb SATA using embedded Intel RSTe software RAID, supporting RAID 0, 1, 10, 5, 50. Optional 12 Gb SAS/SATA RAID using SAS3408-based cacheless RAID controller, supporting RAID 0, 1, 10, 5. Optional 12 Gb SAS/SATA HBA.
Network interfaces	Two 10 Gb interfaces, either 10GBASE-T ports (RJ-45) or SFP+ ports, routed through the Ethernet I/O Module at the rear of the enclosure. Networking ports are based on the Intel Ethernet Connection X722 in the chipset of the SD530 node.
Cooling	Supplied by the D2 Enclosure.
Power supply	Supplied by the D2 Enclosure.