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Hot Sale Thinksystem Sd665 V3 Amd Epyc 9174f Liquid Cooling Innovation High-density Server 1

Hot Sale Thinksystem Sd665 V3 Amd Epyc 9174f Liquid Cooling Innovation High-density Server 2

Hot Sale Thinksystem Sd665 V3 Amd Epyc 9174f Liquid Cooling Innovation High-density Server

Name: Hot Sale Thinksystem Sd665 V3 Amd Epyc 9174f Liquid Cooling Innovation High-density Server
Uploaded: 2025-02-19T19:30:03+08:00
Description: Hot Sale Thinksystem Sd665 V3 Amd Epyc 9174f Liquid Cooling Innovation High-density Server

The Hot Sale ThinkSystem SD665 V3 AMD EPYC 9174F Liquid Cooling High-Density Server is a cutting-edge server with innovative liquid cooling technology. It offers superior performance and efficiency for demanding workloads. Its high-density design allows for optimal data center space utilization and energy savings.

Impress users with:

- Advanced liquid cooling technology for optimal performance

- High-density design for efficient data center space utilization

- Powerful AMD EPYC 9174F processor for superior processing capabilities

Samples:

$4200.0/piece | Min. order : 1 piece

Place of Origin:

China

Payments:

L/C,D/A,D/P,T/T,Western Union,MoneyGram,OA

Lead Time:

1-10(pieces):3(days),11-100(pieces):7(days),101-500(pieces):15(days),>500(pieces):To be negotiated(days)

shipping:

Support Sea freight

Customization:

Customized logo (Min. Order: 10000 sets),Customized packaging (Min. Order: 10000 sets),Graphic customization (Min. Order: 10000 sets)

Model Number:

SD665 V3

Brand Name:

Lenovo

Inquiry

Write a Review

Chassis

NeXtScale n1200 Enclosure (6U)

Memory

1.5 TB memory with 12x 128 GB 3DS RDIMMs

Form factor

Full-wide 1U tray (six per n1200 Enclosure)

processor type

AMD EPYC 9174F

processor main frequency

1.8Ghz

private mold

products status

Stock

Brand

Lenovo ThinkSystem

Power

Hot-swap/redundant power supplies housed in the chassis

Type

Rack

Place of Origin

Guangdong, China

Efficient Performance, Cutting-Edge Cooling

Experience unmatched performance and efficiency with the innovative ThinkSystem SD665 v3 AMD EPYC 9174F blade server featuring liquid cooling technology. This high-density server delivers superior processing power and optimal thermal management for intensive workloads. Upgrade your data center with this cutting-edge solution for seamless operations and maximum productivity.

● Cutting-edge Technology

● Unparalleled Efficiency

● Seamless Computing Experience

● Space-maximizing Design

Product Display

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Powerful Performance Boost

Superior Performance

The Hot Sale Thinksystem SD665 V3 AMD EPYC 9174F Liquid Cooling Innovation High-density Blade Server offers cutting-edge liquid cooling technology and powerful AMD EPYC processors for unmatched performance.

Energy Efficiency

Designed to minimize energy consumption, this high-density server maximizes computing power while reducing operational costs.

Enhanced Reliability

With an innovative liquid cooling system, this server provides improved thermal management and reliability for optimal performance under heavy workloads.

Ideal for Data-intensive Applications

The Hot Sale Thinksystem SD665 V3 AMD EPYC 9174F Liquid Cooling Innovation High-density Blade Server is perfect for data-intensive applications, offering superior computing power and efficiency.

Efficient Cooling High Density

The ThinkSystem SD665 V3 AMD EPYC 9174F server is equipped with liquid cooling technology, ensuring optimal performance and efficiency. This high-density blade server offers innovative cooling solutions, ideal for intensive computing tasks and data center environments. With its powerful AMD EPYC processor and compact design, this server delivers exceptional performance and reliability for demanding workloads.

◎ High-Density Blade Server

◎ Powerful AMD EPYC Processor

◎ Innovative Liquid Cooling

Application Scenario

High-density Data Centers

Efficient liquid cooling

Blade Server Applications

Optimal performance

High-Performance Computing

Powerful AMD Epyc

Advanced Server Solutions

Reliable infrastructure

Material Introduction

The Hot Sale ThinkSystem SD665 V3 AMD EPYC 9174F Liquid Cooling Innovation High-Density Server is crafted with top-of-the-line materials to ensure optimal performance. The blade server is constructed with high-quality components that make it durable and reliable for intensive computing tasks. With advanced liquid cooling technology, this server is designed to keep temperatures at an optimal level, enhancing overall efficiency and productivity.

◎ State-of-the-art materials

◎ Liquid cooling innovation

◎ High-quality components

FAQ

What makes the Thinksystem SD665 V3 server unique?

The Thinksystem SD665 V3 server stands out for its innovative liquid cooling technology, high-density design, and powerful AMD EPYC 9174F processor.

Can the Thinksystem SD665 V3 server handle high-performance computing tasks?

Yes, the Thinksystem SD665 V3 server is designed for high-performance computing tasks thanks to its powerful AMD EPYC 9174F processor and high-density design.

How does the liquid cooling system in the Thinksystem SD665 V3 server work?

The liquid cooling system in the Thinksystem SD665 V3 server efficiently removes heat from the processor and other components, ensuring optimal performance and reliability.

What are some typical applications for the Thinksystem SD665 V3 server?

The Thinksystem SD665 V3 server is ideal for data center environments, cloud computing, virtualization, and other high-performance computing applications.

Is the Thinksystem SD665 V3 server easy to deploy and manage?

Yes, the Thinksystem SD665 V3 server is designed for ease of deployment and management, making it a cost-effective solution for IT administrators.

Can the Thinksystem SD665 V3 server be customized to meet specific storage and networking requirements?

Yes, the Thinksystem SD665 V3 server offers customization options for storage and networking, allowing users to tailor the server to their specific requirements.

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