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Hot Sale H 3c Uniserver R2700 G3 Xeon 4208 Server Jls Future 1u Rack Server

Samples:

$1000.0/piece | Min. order : 1 piece

Place of Origin:

China

Payments:

L/C,D/A,D/P,T/T,Western Union,MoneyGram,OA

Lead Time:

1-10(pieces):3(days),11-100(pieces):7(days),101-500(pieces):15(days),>500(pieces):To be negotiated(days)

shipping:

Support Sea freight

Customization:

Customized logo (Min. Order: 10000 sets),Customized packaging (Min. Order: 10000 sets),Graphic customization (Min. Order: 10000 sets)

Model Number:

R2700 G3

Brand Name:

H3C

Inquiry

Write a Review

CPU

Xeon 4208

Memory

16GB

Form factor

1U Rack server

processor type

Xeon 4208

processor main frequency

1.90Ghz

private mold

products status

Stock

Type

Tower

Place of Origin

Guangdong, China

Product Description

- Virtualization — Support multiple types of core workloads on a single server to simplify Infra-investment.
- Big Data — Manage exponential growth of structured, unstructured, and semi-structured data.
- Storage intensive application — dismiss the performance bottleneck
- Data warehouse/analysis — Query data on demand to help service decision
- Customer relationship management (CRM) — Help you to gain comprehensive insights into business data to improve customer satisfaction and loyalty
- Enterprise resource planning (ERP) — Trust the R4900 G5 to help you manage services in real time
- (Virtual Desktop Infrastructure)VDI —Deploy remote desktop services to provide your employees with the working flexibility anytime, anywhere
- High-performance computing and deep learning — Provide sufficient GPUs to support machine learning and AI applications
- Housing Data center graphics for high-density cloud gaming and media streaming
- The R4900 G5 supports Microsoft® Windows® and Linux operating systems, as well as VMware and H3C CAS and can operate perfectly in heterogeneous IT environments.

Details Images

Hot Sale H 3C UniServer R2700 G3 Xeon 4208 Server JLS FUTURE 1U Rack Server

Specification

CPU	2 x 3rd generation Intel® Xeon® Ice Lake SP series (each processor up to 40 cores and maximum 270W power consumption)
Chipset	Intel® C621A
Memory	32 x DDR4 DIMM slots , maximum 12.0 TB Up to 3200 MT/s data transfer rate,support RDIMM or LRDIMM Up to 16 Intel ® Optane™ DC Persistent Memory Module PMem 200 series ( Barlow Pass)
Storage controller	Embedded RAID controller (SATA RAID 0, 1, 5, and 10) Standard PCIe HBA controller or storage controller
FBWC	8 GB DDR4 cache, depending on model, support supercapacitor protection
Storage	Up to front 12LFF bays, internal 4LFF bays , Rear 4LFF+4SFF bays Up to front 25SFF bays, internal 8SFF bays , Rear 4LFF+4SFF bays Front/Internal SAS/SATA HDD/SSD/NVMe Drives, maximum 28 x U.2 NVMe Drives SATA or PCIe M.2 SSDs, 2 x SD card kit , depending on model
Network	1 x onboard 1 Gbps management network port 2 x OCP 3.0 slots for 4 x 1GE or 2 x 10GE or 2 x 25GE NICs PCIe Standard slots for 1/10/25/40/100/200GE/IB Ethernet adapter
PCIe slots	14 x PCIe 4.0 standard slots
Ports	VGA ports (Front and Rear) and serial port (RJ-45) 6 x USB 3.0 ports (2 front, 2 rear, 2 internal) 1 dedicated management Type-C port
GPU	14 x single-slot wide or 4 x double-slot wide GPU modules
Optical drive	External optical disk drive , optional
Management	HDM OOB system (with dedicated management port) and H3C iFIST/FIST, LCD touchable smart model
Security	Intelligent Front Security Bezel Chassis Intrusion Detection TPM2.0 Silicon Root of Trust Two-factor authorization logging
Power supply	2 x Platinum 550W/800W/850W/1300W/1600W/2000/2400W (1+1 redundancy) 800W –48V DC power supply (1+1 Redundancy) Hot swappable redundant fans
Operating temperature	5°C to 45°C (41°F to 113°F) The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.
Dimensions (H × W × D)	2U Height Without a security bezel: 87.5 x 445.4 x 748 mm (3.44 x 17.54 x 29.45 in) With a security bezel: 87.5 x 445.4 x 776 mm (3.44 x 17.54 x 30.55 in)