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High-density Servers L Enovo Thinksystem Sd665-n V3 Direct Water Cooling Server 1
High-density Servers L Enovo Thinksystem Sd665-n V3 Direct Water Cooling Server 1

High-density Servers L Enovo Thinksystem Sd665-n V3 Direct Water Cooling Server

5.0
عينات:
$4899.0/piece | Min. order : 1 piece
مكان المنشأ:
China
المدفوعات:
L/C,D/A,D/P,T/T,Western Union,MoneyGram,OA
المهلة الزمنية:
1-10(pieces):3(days),11-100(pieces):7(days),101-500(pieces):15(days),>500(pieces):To be negotiated(days)
شحن:
Support Sea freight
التخصيص:
Customized logo (Min. Order: 10000 sets),Customized packaging (Min. Order: 10000 sets),Graphic customization (Min. Order: 10000 sets)
رقم الموديل:
SD665-N V3
اسم العلامة التجارية:
Lenovo
design customization

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    الذهاب إلى الصفحة الرئيسية
    الهيكل
    DW612S Enclosure (6U)
    ذاكرة
    Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray
    عامل الشكل
    Full-wide 1U tray; 1 node+GPUs per tray
    نوع المعالج
    AMD EPYC 9124
    المعالج التردد الرئيسي
    ghz3.0
    قالب خاص
    NO
    حالة المنتجات
    Stock
    ماركة
    Lenovo ThinkSystem
    نوع
    Rack
    مكان المنشأ
    Guangdong, China
    ThinkSystem SD665-N V3 High-density server
    Products Description
    Exascale performance for your AI & HPC workloads
    * Lenovo Neptune™ direct water cooling to support high-performance processors and GPUs
    * Supporting one or two 4th Generation AMD EPYC™ Processors up to 96 cores / 400W
    * Up to 5 GPU nodes installed in the ThinkSystem DW612S enclosure
    * Four NVIDIA HGX™ H100 GPUs up to 700W with NVLink for acceleration
    * NVIDIA Connect X-7 4-chip VPI PCIe Gen5 Mezz Board for GPU direct I/O
    Lenovo Neptune™ accelerated
    A decade of experience in direct water-cooling sets Lenovo apart. Lenovo ThinkSystem SD665-N V3 is based on our fifth generation bLenovo Neptune™ direct water-cooling platform.
    The combination of market leading NVIDIA acceleration technology with the market leading water cooling solution from Lenovo results in extreme performance in an extreme dense packaging.

    Specification

    Form Factor/Height
    Full-wide 1U tray; 1 node+GPUs per tray
    Chassis
    DW612S Enclosure (6U)
    Processors
    1x or 2x 4th Generation AMD EPYC™ Processors per node
    Memory
    Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray
    I/O Expansion
    NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O
    Acceleration
    NVIDIA HGX™ H100 4-GPU with 4x NVLink connected SXM5 GPUs
    Storage
    * Up to 2x 2.5" NVMe SSDs (7mm height) or 1x 2.5" NVMe SSDs (15mm height) per node

    * Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
    RAID Support
    OS Software RAID
    Network Interfaces
    Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
    Power Management
    Rack-level power capping and management via open-source management software Confluent and application-level energy optimization
    through Energy Aware Runtime (EAR)
    Systems Management
    Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity
    Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports
    daisy chaining to reduce cabling requirements
    Front access
    All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External
    Diagnostics Handset port for local management.
    Rear access
    2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
    Power Supply
    * Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or

    * Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy
    Cooling Design
    Direct Water Cooling at the heat source with up to 45°C inlet water temperature
    Detailed picture
    High-density Servers L Enovo Thinksystem Sd665-n V3 Direct Water Cooling Server 2
    High-density Servers L Enovo Thinksystem Sd665-n V3 Direct Water Cooling Server 3
    Company Profile

    Company Information

    Chongqing Chimu Technology Co., Ltd. was established in 2010, we have been engaged in this industry more than 10 years. In order to meet the needs of customers, we have established a perfect supply chain system to provide super products with reliable quality and reasonable price. we are devoted to offering Switches, Routers, OLTs, SDHs, Network Modules, Interface Cards, Security Firewalls, Wireless AP etc. Our long-term aim is to provide users high-quality, efficient, economic, timely services. Looking forward to establish long-term and win-win business relations with you.
    Advantages
    A)Stable and Wide Supply Chain System
    we have established a perfect supply chain system to provide a wide range of products with reliable quality and reasonable price.
    B)Competitive Price
    We ensure the most competitive price. Warm reminders here, telecommunications equipment configuration is quite different, the price shown on the website is only for reference. After configuration and quantity been confirmed, we will give the final most competitive discounted price.
    C) Safe and Easy Payment Solutions
    We accept all major credit cards, PayPal and wire transfer.
    D)Fast Delivery and Shipping
    Fast, professional and reliable delivery.
    E)10 Years Experience
    we have been engaged in this industry more than 10 years, we have rich industry experience.
    Payment
    High-density Servers L Enovo Thinksystem Sd665-n V3 Direct Water Cooling Server 4
    FAQ
    High-density Servers L Enovo Thinksystem Sd665-n V3 Direct Water Cooling Server 5
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